high power t-1 (3 mm), t-1 3 / 4 (5 mm) and rectangular as/ts algaas plastic lamps reliability data description the following cumulative test results have been obtained from testing performed at agilent technologies in accordance with the latest revisions of mil- std- 883 and jis c 7021. HLMP-C10X, c11x, kxxx, r1xx, d1xx, s1xx, and 41xx agilent tests parts at the absolute maximum rated conditions recommended for the device. the actual performance you obtain from agilent parts depends on the electrical and environmental characteristics of your application but will probably be better than the performance outlined in table 1. failure rate prediction the failure rate of semiconductor devices is determined by the junction temperature of the device. the relationship between ambient temperature and actual junction temperature is given by the following: t j ( c) = t a ( c) + q ja p avg where t a = ambient temperature in c q ja = thermal resistance of junc- tion-to-ambient in c/watt p avg = average power dissipated in watts the estimated mtbf and failure rate at temperatures lower than the actual stress temperature can be determined by using an arrhenius model for temperature accelera- tion. results of such calculations are shown in the table on the fol- lowing page using an activation energy of 0.43 ev (reference mil- hdbk-217). stress test total units total failure rate colors conditions device hrs. tested failed mtbf (% /1k hours) as algaas t a = 55 c 4,727,000 1,512 0 4,727,000 0.002 i f = 30 ma ts algaas t a = 55 c 5,572,000 3,668 0 5,572,000 0.002 i f = 50 ma as algaas t a = -40 c 1,428,000 952 0 1,428,000 0.070 i f = 30 ma ts algaas t a = -40 c 1,708,000 560 0 1,708,000 0.059 i f = 50 ma table 1. life tests demonstrated performance point typical performance
2 table 2a. as algaas, 55 c @ 30 ma point typical performance performance [1] in time [2] in time (90% confidence) ambient junction failure rate failure rate temperature ( c) temperature ( c) mtbf [1] (%/1k hours) mtbf [2] (%/1k hours) +85 +108 1,543,000 0.065 670,000 0.149 +75 +98 2,197,000 0.046 954,000 0.105 +65 +88 2,188,000 0.031 1,385,000 0.072 +55 +78 4,727,000 0.021 2,053,000 0.049 +45 +68 7,172,000 0.014 3,115,000 0.032 +35 +58 11,159,000 0.009 4,846,000 0.021 +25 +48 17,847,000 0.006 7,751,000 0.013 notes: 1. the point typical mtbf (which repre- sents 60% confidence level) is the total device hours divided by the number of failures. in the case of zero failures, one failure is assumed for this calculation. 2. the 90% confidence mtbf represents the minimum level of reliability perfor- mance which is expected from 90% of all samples. this confidence interval is based on the statistics of the distribu- tion of failures. the assumed distribution of failures is exponential. this particular distribution is com- monly used in describing useful life example of failure rate calculation assume a device operating 8 hours/day, 5 days/week. the utilization factor, given 168 hours/week is: (8 hours/day) x (5 days/week) / (168 hours/week) = 0.25 for 55 c and 50 ma: the point failure rate per year (8760 hours) at 75 c ambient temperature is: (0.037% / 1k hours) x 0.25 x (8760 hours/year) = 0.081% per year similarly, 90% confidence level failure rate per year at 75 c: (0.086% / 1k hours) x 0.25 x (8760 hours/year) = 0.188% per year table 2b. ts algaas, 55 c @ 50 ma point typical performance performance [1] in time [2] in time (90% confidence) ambient junction failure rate failure rate temperature ( c) temperature ( c) mtbf [1] (%/1k hours) mtbf [2] (%/1k hours) +75 +110 2,718,000 0.037 1,181,000 0.085 +65 +100 3,854,000 0.026 1,674,000 0.060 +55 +90 5,572,000 0.018 2,420,000 0.041 +45 +80 8,225,000 0.012 3,572,000 0.028 +35 +70 12,419,000 0.008 5,394,000 0.019 +25 +60 19,223,000 0.005 8,349,000 0.012 failures. refer to mil-std-690b for de- tails on this methodology. 3. a failure is any led which is open, shorted, or fails to emit light.
3 table 3. environmental tests mil-std-883c jis c 7021 units units test name reference ref. test conditions tested failed temperature cycle 1010 method a-4 -55 c to 120 c; 15 minute dwell, 24,388 5 5 minute transfer, 100 cycles resistance to 2003 method a-1 260 c for 5 seconds/2x dip 47,488 0 soldering heat cond. a solderability 2003 method a-2 230 c for 5 sec. 1 to 1.5 mm from body, 420 0 95% solder coverage of immersed area power temp. agilent req. agilent req. -40 c to 85 c; 15 min. dwell, 5 min. 224 0 cycle transfer @ 20 ma 5 min. on/off 1000 cycles power temp. agilent req. agilent req. -40 c to 85 c; 18 min. dwell, 42 min. 448 0 cycle transfer @ 30 ma 5 min. on/off 100 cycles humidity life agilent req. agilent req. 85 c, 85% rh, 20 ma, 1000 hours 1,118 0 resistance to 2015 n/a 1. z propanol/mineral spirit solution 224 0 solvents (1:3 by volume). 2. propylene glycol monomethylether/monoethanolamine/di water solution (1:1:42 by volume). 3. semiaquous solvent with a minimum of 60% limonene and skysol 600. esd eiaj ed- method c-111, condition a 60 0 4701 mil-std-883c jis c 7021 units units test name reference ref. test conditions tested failed mechanical 2002 method a-7 max. acceleration: 14700 m/s 2 with 60 0 shock test condition f 0.5 m/s pulse width, 3x each direction vibration variable 2007 method a-10 100-2000-100 hz frequency range in 60 0 frequency condition d 4 min., 196 m/s 2 peak-to-peak acceleration, 48 min. total free drop test n/a method a-8 drop from 75 cm 3x 60 0 termination 2004 method a-11 1 kg. load for 30 sec. 5 n. load on lead 60 0 strength tests i and iii with 90 bend constant 2001 method a-9 1 min. each 6 directions, 196,000 m/s 2 60 0 acceleration condition d table 4. mechanical tests
www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies, inc. obsoletes 5965-9656e 5968-4127e (11/99)
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